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COTS Products | March 2017

 

DDR4 High Density Secure Memory Device Boasts Ruggedized Package

Mercury Systems has announced its latest high density secure memory product, integrating DDR4 SDRAM with its SWaP-efficient packaging technology. Replacing up to eighteen industrial or commercial DDR4 devices with a single military-hardened component, the device delivers space savings up to 75 percent in a ball grid array (BGA) package with data transfer speeds up to 3200 Mb/s. Mercury’s Advanced Microelectronics Center (AMC) in Phoenix, Ariz., will produce 8 Gbyte DDR4 devices in the second half of 2017 to support next-generation customer designs. 2 Gbyte and 16 Gbyte devices are slated for production thereafter.

The three-dimensional packaging technology developed by Mercury transforms a two-dimensional array of discrete memory devices into a single, vertically stacked, dense BGA package without sacrificing the benefits of DDR4 adoption. Component selection and integration is optimized through advanced thermal, mechanical and electrical modeling. Mercury’s precision engineering delivers the robust mechanical integrity needed to withstand the harshest of operating environments. For enhanced board-level reliability over commercial memory devices, lead alloy solder is used for the mechanical and electrical interface to the customer’s mission computing subsystems.

The product also features supply chain security and trust integrated through the complete lifecycle of the high density secure memory portfolio. From low-rate initial production through full-rate production, all high density secure memory products are manufactured exclusively in the Company’s Defense Microelectronics Activity (DMEA) trusted facility. Mercury has been recognized by the Defense Security Service (DSS) with multiple Superior ratings for several of its AMC facilities. All design and manufacturing records are protected with an active cybersecurity program modeled after the Center for Internet Security (CIS) critical security controls.

Mercury Systems
Chelmsford, MA
(866) 627-6951
www.mrcy.com

 

System Allows High-Quality Digital Radar Data Manipulation

Cambridge Pixel has announced RadarVision, a plug and play system which converts radar data into camera-like data stream to display on any security video management system (VMS). Additionally, the radar images displayed alongside the camera images can be zoomed and panned using an on-screen or physical joystick with the PELCO-D interface from the VMS. It is compatible with a wide range of security, maritime and specialist radars. The unit can enhance the radar information by integrating new information to it and display the final output to regular video unit. Radar video signals are input via an acquisition card, as ASTERIX CAT-240 network data or in proprietary formats. The data is then scan converted into a plan image and output as a H.264 (RTSP packaged) network video stream that feeds directly into the VMS to be viewed alongside data from traditional daylight and thermal cameras.

Traditionally, radar signals are displayed in relatively low resolution and the data cannot be modified or manipulated. The new approach allows data to be more versatile and useful. Most important of all, the system allows can integrate the radar information other data. For example, maps can be displayed with radar signal on top with manipulation. The unit is available as either software-only version or a complete software /hardware solution and is commonly used in mission critical applications such as naval, vessel traffic, air traffic control, commercial shipping and airborne radar.

Cambridge Pixel
Cambridge, UK
+44 (0) 1763 852749
www.cambridgepixel.com

 

Skylake-S Processor-based SBC Features 32 Gbyte of DDR4 DRAM

WIN Enterprises has announced the MB-83940, a single board computer based on the 6th Gen Intel Core processor-based (formerly code-named the Intel Skylake-S 13/15/17). Gen 9 Graphics, Integrated Intel Iris Pro GT4e graphic engine is used to support 3 active displays with one HDMI/ 4K (4096 x 2304 resolution) with 15W audio. Two DDR4 memory modules deliver up to 32 Gbytes with 2 Mbytes of non-volatile MRAM (up to 16 Mbytes). 2x GbE LAN I/O is available for networking. Dual BIOS and security boot support are built-in. The unit is compliant with the gaming/casino GLI standards.

WIN Enterprises
North Andover, MA
(978) 688-2000
www.win-ent.com

 

Universal Generic Platform Enables Rapid FPGA Prototyping

Hitex has created Tanto3—a universal generic platform which can be used for rapid FPGA prototyping. Tanto3 can be modified to the user’s needs by simple programming and is ideal for test applications, signal and bus analysis, debugging and programming as well as FPGA development. The platform is equipped with high-speed communication interfaces (USB3.0, Gigabit Ethernet) and a 3,5 inch TFT color touch screen. The fanless passive cooled system with its Cyclone V SoC control processor, a 1GB DDR3 RAM, a powerful Stratix V and 24 Mbytes of SSRAM can be configured and used for sophisticated designs. Applications requiring fast I/O access with complex processing power can be hosted on the FPGA and thus make the design more efficient.

Hitex
Karlsruhe, Germany
+49 721 9628-0
www.hitex.com

 

Solderless Socket for NXP’s BGA141 Supports 75 GHz

Ironwood Electronics has announced the 75 GHz Socket for NXP’s BGA141. The GT-BGA-2061 socket has less than 1dB of insertion loss and can be directly mounted on the target PCB without soldering. It supports 10×10 mm package size and other passive components can be placed on the back side of PCB making it very real-estate friendly overall. Using compression screw and adding axial flow fan, the socket can be customized to work with packages up to 100 W with modified fin design on top of the screw.

The contact resistance is typically 30 milliohms per pin and the 131BGA is 0.65mm pitch 13×13 array. The socket is constructed with a swivel lid to facilitate quick insertion and removal of IC by applying downward pressure with the turning of the compression screw. The socket is made of low inductance elastomer contactor and supports temperature range from -55 to +160 degrees C. Quantity 1 pricing is $623.

Ironwood Electronics
Eagan, MN
(800) 404-0204
www.ironwoodelectronics.com

 

Atom E3900-based Qseven 2.1 Module Provides IC-Level Security

Portwell Technology has announced the Intel Atom E3900 series-based, PQ7-M108, Qseven 2.1 module. The E3900 series integrates the Gen 9 graphics with four vector image processing units and the Time Coordinated Computing (TCC) Technology to synchronize connected devices within a microsecond. Additionally, the unit is designed with security at the chip level by using Infineon’s OPTIGA TRUST IC to prevent unauthorized parties from re-use or re-provisioning of the original parts.

Up to 8 Gbytes of LPDDR4 (2400MT/s) RAM and 64 Gbytes of eMMC5.0 are available on board. Five available Intel Apollo Lake processors can be selected with software support from Linux, Microsoft Windows 10, Windows IoT Core, Wind River VxWorks 7 and Android. Multimedia interfaces include dual-channel LVDS (up to 1920 x 1200 at60Hz), DDI option of either DisplayPort 1.2 (up to 4096 x 2160 pixels) or HDMI 1.4b (up to 3840 x 2160). I/O available include 3 x USB 3.0or 4x USB 2.0, 1x SDIO 3.0, 2x SATA 3, and up to 4x PCIe Gen2 lanes. Also, onboard are 1x I2C, 1x UART, HDA co-lay with I2S, 2x SPI, and a JTAG for debugging function. The module measures 70 x 70 mm and operates from 70 x 70 mm. Its target market includes smart building control and Human Machine Interface (HMI) devices.

American Portwell Technology
Fremont, CA
(510) 403-3399
www.portwell.com

 

Lowest Power Cost-Optimized FPGAs Sport 12.7G Transceivers

Microsemi has announced its cost-optimized PolarFire FPGA product family, delivering low power, 500K logic elements and 12.7 Gbps Serializer/ Deserializer (SerDes) transceivers as well as best-in-class security and reliability. The devices are also well-suited to applications within the defense and aerospace market, such as encryption and root of trust, secure wireless communications, radar and electronic warfare (EW), aircraft networking, actuation and control. The 12.7 Gbps transceivers are fully optimized to be area efficient and low power, resulting in total power of less than 90 mWs at 10 Gbps. Standby power is 130 mWs at 25 degrees C, up to 50 percent lower power than competing FPGAs for the same application.

Leveraging Microsemi’s expertise in security, PolarFire FPGAs offer Cryptography Research Incorporated (CRI) patented differential power analysis (DPA) bitstream protection, integrated physically unclonable function (PUF), 56 Kbytes of secure embedded non-volatile memory (eNVM), built-in tamper detectors and countermeasures, true random number generators, integrated Athena TeraFire EXP5200B Crypto Co-processors (Suite B capable) and a CRI DPA countermeasures pass-through license.

The devices’ cost-optimized architecture uses 28 nanometer (nm) Silicon-Oxide-Nitride-Oxide-Silicon (SONOS) non-volatile process technology on standard complementary metal oxide semiconductor (CMOS). PolarFire FPGAs also incorporate transceiver performance optimized for 12.7 Gbps enabling smaller size and lowest power, hardened I/O gearing logic for double date rate (DDR) memory and low-voltage differential signaling (LVDS), high performance security IP and the industry’s only low cost mid-range device with clock and data recovery (CDR) capable 1.6 Gbps I/Os. Microsemi’s PolarFire FPGA product family is shipping to early access customers now and samples for general availability will be offered in the second quarter of 2017.

Microsemi
Aliso Viejo CA
(949) 380-6100
www.microsemi.com

 

FMC Offers Four ADCs, Two DACs and High SNR Performance

Innovative Integration has announced the FMC-SDF. The FMC-SDF FMC module features four 24-bit, ADCs and two, 18-bit DACs, each simultaneously-sampling and DC-accurate. These ultra-high resolution, sigma-delta devices support high dynamic range applications such as stimulus-response, ATE, and seismic data acquisition. Ultra-low jitter clock and trigger controls provide ultimate analog fidelity coupled with precisely framed acquisition and playback. Captures may be triggered via software or external LVCMOS edges.

The FMC-SDF power consumption is under 15 W for typical operation. The module may be conduction cooled using a VITA20 standard heat-spreader. The product may be conformal coated and ruggedized for wide-temperature operation from -40 to +85 degrees C operation and exposure to 0.1 g2/Hz vibration. Support logic in VHDL is provided for Innovative’s broad line of FPGA-accelerated FMC carriers. The Framework Logic package supports development under Xilinx Vivado using VHDL or HLS (high-level synthesis). Additionally, the Matlab BSP within the Framework supports real-time hardware-in-the-loop development using the graphical block-diagram Simulink environment and Xilinx System Generator.

Innovative Integration
Simi Valley, CA
(805) 578-4260
www.innovative-dsp.com

 

100A Point-of-Load DC-DC Converter Supports PMBus

TDK has announced the iJC series of POL (Point of Load) non-isolated DC-DC converters. The 100A non-isolated DC-DC converter supports the PMBus which allows programmability of the iJC parameters and real-time, precision monitoring of voltage, current and temperature. When PMBus is not implemented, functional pins are available for development purpose. Additionally, GUI (Graphical User Interface) and evaluation boards are also available.

The iJC series operate from an 8 to 14VDC (input) and 0.6 to 1.5V (output) with a set point accuracy of 0.5 percent. Overall power module efficiency is 91.5 percent (typical) with a 1.5V output, 12V input and 80 percent loading. The unit measures 28mm x 35mm x 10mm weighs 20g. Maximum power output is 150W which translates into 66 Amps per cubic inch. Target applications include servers, routers, information & communication technology (ICT) equipment, semiconductor manufacturing equipment, test & measuring and other industrial equipment. The products are available through distributors worldwide.

TDK-Lambda Americas
San Diego, CA
(619) 628 2885
www.us.tdk-lambda.com/lp

 

3U VPX H.265 Video Encoder Boasts Dual 3G-SDI Inputs

EIZO Rugged Solutions has introduced a rugged 3U VPX H.265 High Efficiency Video Encoding (HEVC) video/audio encoder. The Condor VPX-H265-SDI features dual 3G-SDI inputs and support for CoT (Cursor on Target), KLV (Key Length Value), and VANC (vertical ancillary data) metadata insertion. The board is a H.265 (HEVC) or H.264 video encoding and streaming solution designed for harsh field environments. The Condor VPX-H265-SDI encodes and streams two 3G-SDI, HD-SDI, or SD-SDI inputs simultaneously using the highly versatile video coding standard H.265 (HEVC) which provides increased video quality and a 50 percent reduction in bitrate compared to H.264.

The H.265 encoding parameters are highly configurable with main profile support as well as variable and constant bitrate configurations (512 Kbps to 15+ Mbps). The board also supports CoT and KLV metadata insertion via RS-232 or Ethernet. The card also allows vertical ancillary data (VANC) to be streamed efficiently in non-picture regions of the frame. USB 3.0 with encoded data is also supported on the new VPX product for external recording to benign or rugged removable hard drives. The Condor VPX-H265-SDI is a MIL-STD-810G compliant card ruggedized too withstand vibration, shock, and humidity and support temperatures from -40 to 85 degrees C.

EIZO Rugged Solutions
Altamonte Springs, FL
(407) 262-7100
www.eizorugged.com

 

QorIQ T208 PrXMC is Supported by Wind River VxWorks 653

Extreme Engineering Solutions (X-ES) has announces the availability of a NXP QorIQ T2081 processor- based COTS board solution, the XPedite6101, with a certification-ready multi-core operating system environment, Wind River VxWorks 653 3.0 Multi-core Edition platform. The fully ARINC 653-compliant VxWorks 653 enables avionics vendors and hosted-function suppliers to independently develop and deploy multiple applications on a single multi-core hardware platform, supporting rigorous avionics safety standards. The XPedite6101 XMC/PrPMC mezzanine module supports multiple NXP QorIQ processor configurations, a number of I/O ports including Gigabit Ethernet, serial, USB, and SATA, and up to 8 GB of DDR3-1600 ECC SDRAM.

Extreme Engineering Solutions
Middleton, WI
(608) 833-1155
www.xes-inc.com

 

Secure Rugged Tablet is Designed for Tactical Operations

Getac has introduced its first rugged tactical tablet, built from the ground up, for combat-ready military forces. Designed from feedback from Special Forces and tactical operators, the Getac MX50 rugged tactical tablet is battle-ready tough. It is MIL-STD 810G and MIL-STD 461 certified and IP67 waterproof. Its large, 5.7-inch screen offers a bright, 480 nit sunlight-readable display with glove-touch and night vision capabilities. The chest mount is designed to integrate with a standard issue MOLLE vest, providing hands-free carrying and ease of access. The MX50 meets the Common Criteria ISO/IEC 15408 computer security certification, and the NSA’s Commercial Solutions for Classified (CSfC) guidelines (certification pending) and Data-at-Rest (DAR) requirements.

Getac USA
Irvine, CA
(949) 681-2900
www.us.getac.com

 

Precertified Rugged, NAS Device Reduces Development Time

Curtiss-Wright has announced the rugged DTS1, a COTS data-at-rest (DAR) storage device that complies with the Commercial Solutions for Classified (CSfC) 2-Layer Encryption requirement, endorsed by NSA. Usually the development and certification can take 36 months with a total cost of $5 million. NSA has approved an alternative approach called 2-Layer Encryption End User device (EUD) list. Because the EUD is pre-certified, OEM and system integrators can include it in the system to reduce development and certification time.

The CSfC 2-Layer Encryption certified, DTS1, is a single-slot NAS device which supports the PXE protocol that all network clients on board of a vehicle or aircraft can boot from the encrypted files on the DTS1’s removable memory cartridge (RMC). Additionally, the RMC (128 Gbytes to 2 Terabytes) physical data transfer from one DTS1 to another with Suite B encryption. The optional packet capture software (PCAP) enables Ethernet packet recording for later analysis and the iSCSI support makes sharing data easier.

Data formats that support industry standard protocols such as NFS, CIFS, FTP, or HTTP can store data on the DTS1. The target applications will be storage, removal, and transport of critical data such as cockpit data (mission, map, maintenance), ISR (camera, I&Q, sensors), mobile applications (ground radar, ground mobile, airborne ISR pods), heavy industrial (steel, refinery), and video/audio data collection (flight test instrumentation) in helicopters, UAVs, UUVs and UGVs. The unit measures 1.5 x 5.0 x 6.5-inches (38.1 x 127 x 165.1 mm) and weighs 4.0 lb.

Curtiss-Wright Defense Solutions
Ashburn, VA
(703) 779-7800
www.curtisswrightds.com

 

AMC Board Serves up Latest Gen of Xeon Processor E3-1500 v6

Concurrent Technologies has announced AM G6x/msd, an AdvancedMC (AMC) module that is its first product to support the latest generation of Intel Xeon processor E3-1500 v6. Customers will be able to specify a choice of processors including the Intel Xeon processor E3-1505M v6 or Intel Xeon processor E3-1505L v6. These are both high performance 4-core devices with Intel HD Graphics P630 and are optimized to create board variants with high compute performance or low power consumption respectively. AM G6x/msd has an on board 64 Gbytes of Solid State Drive (SSD) and wo sites for M.2 storage modules based on PCI Express M-key interconnects supporting the new Non-Volatile Memory Express (NVMe) protocol. AM G6x/msd is also the first board from Concurrent Technologies that has support for the future Intel Optane range of 3D XPoint modules. These are expected to be made available during 2017 and offer the promise of further improvements in storage speed.

Compared to Concurrent Technologies previous AMC products, AM G6x/msd offers improved CPU and memory performance. A version will also be available offering dual 10 Gigabit Ethernet connectivity for higher speed networking with the ability to connect via either electrical or fiber links making it more suitable for use in remote locations. As with all other Concurrent Technologies products, AM G6x/msd is designed for long life-cycle applications. Concurrent Technologies has a wide product range including VME, VPX, CompactPCI, XMC and AdvancedMC processor boards and further products supporting Kaby Lake will be announced during 2017.

Concurrent Technologies
Woburn, MA
(781) 933-5900
www.gocct.com

 

Server-Grade COM Express Module Serves up 64 GB of DDR Memory

Advantech has announced the COM Express module, SOM-5992, powered by the Intel Xeon Processor D-1500 Family and support up to 16-core (with TDP) and 64 Gbytes DDR4 memory. The unit complies with the PICMG COM.0 R3.0 type 7 COM Express Basic Module and is configurable to Gen3 PCIe x16, x8 and 8×1 expansion. Additionally, it is integrated with two 10GBASE-KR interfaces and 1000BASE-T. The dual DDR4 2400 runs at 1.2V. It supports iManager, WISE-PaaS/RMM and Embedded Software APIs. The COM Express Basic module measures 125mm x 95mm with overall power consumption of 45W and targets the server markets.

Advantech
Irvine, CA
(949) 420-2500
www.advantech.com

 

TI Sitara-based COM Module Boasts Small Footprint Format

MEN Micro has announced the CM10, the Texas Instruments Sitara ARM Cortex-A15 AM57xx- based COM Module. Targeting the industrial communication and IoT and gateway market, the fanless unit can be configured with single or dual core processor and Up to 2 Gbytes DDR3 SDRAM with ECC, soldered with eMMC multimedia card. I/O is flexible with two Gb Ethernet, two PCI Express interfaces, SATA, USB, UARTs, CANbus, video, audio, and a SD card interface. Graphics resolution is 1920 x 1080 pixels with optional HD video and both 3D and 2D. Operating temperature range is from -40 to +85 degrees C.

MEN Micro
Ambler, PA
(215) 542-9575
www.menmicro.com