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COTS Products | April 2017

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COTS Products | April 2017

 

Intel Atom E38xx-based EBX SBC Provides Extended Capabilities

Versalogic has announced the “Viper”, an EBX format, fanless SBC with a choice of performance level; single, dual-, and quad-core models. Compare with the “Montevina” Core 2 Duo processor, the Intel Atom E38xx-based quad-core unit can deliver twice the performance with overall power consumption of 6 watts (typical), one-third less. Two levels of security are provided. The on-board Trusted Platform Module (TPM) security chip prevents unauthorized access and the built-in AES (Advanced Encryption Standard) processor instructions adds additional protection. The target market includes defense, medical and industrial control requires protection against cyberattacks.

On-board I/O ports include a USB 3.0 port, six USB 2.0 ports, two 10/100 Ethernet, four serial ports, thirty-two digital I/O lines, eight 12-bit analog inputs and four 12-bit analog outputs. Additionally, the Dual SATA interfaces support high-capacity rotating or solid-state drives. Intel’s gen 7 HD graphic processor supports two simultaneous 1080p video streams, encoding and decoding of H.264, MVC, VP8, VC1/WMV9 and other standards. Furthermore, it supports dual display support, DirectX 11, Open GL 4.0 and full HD video playback with resolution up to 2560 x 1600 at 60Hz. Video interfaces include the mini DisplayPort++ outputs, VGA and a single/dual-channel LVDS display outputs.

The unit can be expanded via its dual Mini PCIe sockets for plug-in Wi-Fi modems, GPS receivers, other mini cards (MIL-STD-1553, Ethernet, and Analog) and a microSD socket for solid-state drive (SSD). The Viper is designed for rugged applications with temperature ranges from -40 to +85 degrees C. It meets [...]

By |April 20th, 2017|Articles, COTS Journal, COTS Products|Comments Off on COTS Products | April 2017|

COTS Products | March 2017

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COTS Products | March 2017

 

DDR4 High Density Secure Memory Device Boasts Ruggedized Package

Mercury Systems has announced its latest high density secure memory product, integrating DDR4 SDRAM with its SWaP-efficient packaging technology. Replacing up to eighteen industrial or commercial DDR4 devices with a single military-hardened component, the device delivers space savings up to 75 percent in a ball grid array (BGA) package with data transfer speeds up to 3200 Mb/s. Mercury’s Advanced Microelectronics Center (AMC) in Phoenix, Ariz., will produce 8 Gbyte DDR4 devices in the second half of 2017 to support next-generation customer designs. 2 Gbyte and 16 Gbyte devices are slated for production thereafter.

The three-dimensional packaging technology developed by Mercury transforms a two-dimensional array of discrete memory devices into a single, vertically stacked, dense BGA package without sacrificing the benefits of DDR4 adoption. Component selection and integration is optimized through advanced thermal, mechanical and electrical modeling. Mercury’s precision engineering delivers the robust mechanical integrity needed to withstand the harshest of operating environments. For enhanced board-level reliability over commercial memory devices, lead alloy solder is used for the mechanical and electrical interface to the customer’s mission computing subsystems.

The product also features supply chain security and trust integrated through the complete lifecycle of the high density secure memory portfolio. From low-rate initial production through full-rate production, all high density secure memory products are manufactured exclusively in the Company’s Defense Microelectronics Activity (DMEA) trusted facility. Mercury has been recognized by the Defense Security Service (DSS) with multiple Superior ratings for several of its AMC facilities. All design and manufacturing [...]

By |March 28th, 2017|Articles, COTS Journal, COTS Products|Comments Off on COTS Products | March 2017|

COTS Products | February 2017

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3U VPX SBC Serves Up Xilinx Zynq Ultrascale+ SoC

PanaTeQ has introduced the VPX3-ZU1, an expandable SBC a 3U (100 x 160mm) OpenVPX compatible board. The VPX3-ZU1 owes its performance. In a single device, the Zynq UltraScale+ integrates a Quad-core 1.5GHz 32/64-bit ARM Cortex-A53 based Application Processing Unit (APU), a Dual-core ARM Cortex-R5 based Real-Time Processing Unit (RPU), an ARM MALI-400 based GPU and a large Programmable Logic (PL) Array. The device also includes on-chip memory, external memory interfaces, and a rich set of peripheral connectivity interfaces.

The VPX3-ZU1 includes an FMC connector allowing the board to be targeted to specific applications by fitting it with any compatible front end I/O interfaces, such as ultra-high speed Analog to Digital Converters, Video Adapters, or high speed networking ports. The FMC site is compliant to the Vita 57.1 HPC standard and includes 90 Single Ended IO (45 Differential Pairs) and 10 Multi Gbit Transceivers.

The multiple Cores and Programmable Logic can operate together to resolve today’s and tomorrow’s most demanding embedded computing challenges, in applications ranging from Software Defined Radio, Image Processing, Target Detection, EW / ISR, advanced Multi-Axes Motors controller, Multi-Gigabit Ethernet Communications, to LIDAR / RADAR / SONAR. Using Xilinx’s powerful SDSoC Development Environment, the User Application Code can easily be partitioned between the Zynq’s available Cores, and the Programmable Logic. The air cooled PanaTeQ System Development Kit VPX3-ZU1-PSDK is available for the developers and includes a lab chassis with 3-slots OpenVPX CEN03-15-2-9 backplane, the VPX3-ZU1-B1-AC and RTM-ZU1-A1 boards, a PentaLinux BSP, the PanateQ FPGA Design Kit (PAN-FDK) and [...]

By |March 6th, 2017|Articles, COTS Journal, COTS Products, February 2017|Comments Off on COTS Products | February 2017|

COTS Products | January 2017

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Embedded PXIe Module Marries Zynq Z7045 SoC and FMC I/O

Innovative Integration has announced the COPious-PXIe—an 8HP PXIe -compatible plug-in card that employs the Xilinx Z7045 (Zynq) system- on-chip processor. The SoC provides dual, floating-point, ARM A9 CPUs and a large user-programmable FPGA fabric. COPious-PXIe incorporates a high pin-count VITA 57.1 -compliant FMC module site. FMC peripherals are directly controlled by the on- board FPGA fabric, enabling deep integration of sophisticated, user-customized digital signal processing algorithms. Real-time, DSP and mixed-signal applications such as software-defined radio, RADAR, LIDAR, optical control and other demanding applications may be efficiently addressed, even in conjunction with conventional PXIe system controllers running non-real-time operating systems such as Windows or Linux.

COPious-PXIe runs bare-metal C/C++ applications in core 1 and the PetaLinux core/applications core 0 and, providing zero-overheat interrupt processing and real-time code execution in conjunction with high-level Ethernet, USB and disk connectivity. PetaLinux boots rapidly from an on-board eMMC flash drive, providing bullet-proof autonomous operation and fast local storage. It’s rugged, flexible and ready for immediate deployment into your next Test & Measurement or embedded application. The product can be readily tailored to a variety of markets including embedded instrumentation, remote, autonomous IO, mobile instrumentation, and distributed data acquisition.

Innovative Integration
Simi Valley, CA
(805) 578-4260
www.innovative-dsp.com

Conduction-Cooled SFF Embedded Computer Boasts Xeon Processor

The EC500 from DFI Tech features a 22nm Intel Xeon processor E3-1200 v3 family and 6th/4th generation Intel Core i7/i5/i3 processor. [...]

By |February 23rd, 2017|Articles, COTS Journal, COTS Products|Comments Off on COTS Products | January 2017|